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Polishing Suspensions

EXTEC Polishing Suspensions for every application, including final polishing, high and low pH polishing, high and low removal polishing, alpha and gamma polishing, agglomerated and de-agglomerated polishing, polishing of soft and hard materials and composites.

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C-K:
Fast, convenient and economical, the C-K (Clear-Kling) System uses a revolutionary clear backing that allows adhesion without adhesives. C-K discs can be applied to any platen. Select your desired C-K cloth, abrasive disc or diamond lapping film and apply to platen - it instantly adheres. When finished just lift and replace with the next item. C-K discs stay on the platen and may be used repeatedly. Available on a variety of Extec products.
PSA:
PSA (Pressure Sensitive Adhesive) backing that is oil, water & alcohol resistant.
Cloth:
Cloth backing is available for most products.
Plain:
Plain backing is available for most products.
Poly Back:
Extec Poly backing.
Maxima:
Non-metallic, magnetic compatible backing.

  • Multipolish (Aluminum Oxide, Silicon Dioxide) Blend

    A specially formulated blended permanent suspension of 0.05 µm Aluminum Oxide and Silicon Dioxide particles with a pH of 9. Recommended for final polishing of cobalt-based alloys, nickel-based alloys, steels, tool steels, electronics, printed circuit boards.

  • Final Polish A Aluminum Oxide

    A specially formulated permanent suspension of 0.06 µm Aluminum Oxide particles with a LOW (4 pH) aqueous base for final polishing. Recommended for material that responds well in a low pH environment, alumina, ceramics, plastics, electronics.

  • Final Polish B Silicon Dioxide

    A specially formulated permanent suspension of 0.06 µm Silicon Dioxide particles with a HIGH (10 pH) aqueous base for final polishing. Recommended when a high pH is needed for aluminum, brass, copper, lead-based alloys, precious metals, titanium, other nonferrous materials.

  • Multigam Final Polishing

    A specially formulated Aluminum Oxide (Al2O3) general purpose permanent suspension that provides a high removal rate for most materials.

  • Alumina

    Alpha and gamma polishing powders for superior polished sample surfaces. Available in 0.3, 0.05 and 1.0 micron grades.

    Levigated available in 2.0, 5.0 and 10.0 micron grades.

  • EXTEC I De-Agglomerated Alumina

    De-agglomerated alpha and de-agglomerated gamma polishing permanent suspensions. Available in 0.3, 0.5 and 1.0 micron grades.

  • Colloidal Silica

    Available in 0.06 µm and 0.02 µm particle size. Recommended for composites, silicon nitride, cobalt-based alloys, nickel-based alloys, steels, tool steels, electronics and printed circuit boards.

  • Cerium Oxide

    1.0 µm; Recommended as the final polish for glass and other soft materials.

  • Chromic Oxide

    1.0 µm and .0.5 µm; Recommended for samples that cannot be exposed to Aluminum Oxide Contamination.