1.800.54.EXTEC (543.9832)  |  About
   

Polishing Suspensions

EXTEC ® Final Polish B Silicon Dioxide

A specially formulated permanent suspension of 0.06 µm (SiO2) particles with a HIGH (10 pH) aqueous base for final polishing. Recommended when a high pH is needed for aluminum, brass, copper, lead-based alloys, precious metals, titanium, other nonferrous materials.

Info: Not sure which Polishing Suspensions are right for you? Create an Account or Sign In.

C-K:
Fast, convenient and economical, the C-K (Clear-Kling) System uses a revolutionary clear backing that allows adhesion without adhesives. C-K discs can be applied to any platen. Select your desired C-K cloth, abrasive disc or diamond lapping film and apply to platen - it instantly adheres. When finished just lift and replace with the next item. C-K discs stay on the platen and may be used repeatedly. Available on a variety of Extec products.
PSA:
PSA (Pressure Sensitive Adhesive) backing that is oil, water & alcohol resistant.
Cloth:
Cloth backing is available for most products.
Plain:
Plain backing is available for most products.
Poly Back:
Extec Poly backing.
Maxima:
Non-metallic, magnetic compatible backing.
Organize Products By:
Catalog # Unit Micron
Size
Description  
16762
6 oz (150 ml) 0.06µ(10 pH)
16764
64 oz (1.9 l) 0.06µ(10 pH)
Key:
  • New New
  • Special Packaging Special Packaging
Pricing found on www.extec.com is U.S. only.