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Thumbnail Filmstrip of EXTEC Labcut® Micro 1.0 Images
The Extec Labcut® Micro 1.0 is a Variable Speed Precision Diamond Saw. It is designed for precision cutting of a wide variety of materials across various applications with minimal deformation.
The EZ-DRO-M Keypad and dial simplify the user experience and control the unit’s functions with 0.01 mm (< .004”) accuracy.
The specimen is held by a specimen arm. The adjustment knob, located outside the cutting chamber, allows micrometer controlled movement of the X-axis.
The cutting feed is gravity fed with a built-in weight that travels along the specimen arm. The weight aids in delicate precision cutting.
A robust metal interior and exterior construction ensure stable and vibration free cutting.
The transparent safety canopy eliminates any spray outside the machine and allows easy access for clamping vices on the arm. The canopy is fitted with a safety sensor that stops the cutting wheel if it is opened.
An external filter/recirculation tank with pump (200 gal/min) is included, allowing the user to easily make slow cuts with optimum cooling conditions.
A range of sample holders is available for clamping specimens and materials of any kind.
- Hinged transparent safety canopy eliminates spray outside of machine
- Simple user interface controlled by the EZ-DRO-M keypad with dial
- Micrometer controlled movement along the Z-axis with automatic shut-off
- Includes an external 2.6 gal recirculating coolant system
- Wide range of sample holders and clamping devices available
- Accepts 3 inch (75 mm), 4 inch (100 mm), 5 inch (125 mm), and 6 inch (150 mm) diameter blades with a ½” (12.7 mm) spindle
- Micrometer: 0-25 mm (1 inch) with 0.01 mm (< .004”) accuracy
- Load Weight: 1 × 200 g
- Variable Speed: 50-1000 rpm
- 220 volts, 1 phase; 1/2 hp (0.18 kW)
- Dimensions: L 16” × W 15.5” × H 11.5”, 55 lb (25 kg)
- Materials: Slicing samples of metals, alloys, composites.
- Ceramics: Slicing samples of ceramics.
- Semiconductor: Cutting semiconductor crystals and sectioning embedded devices.
- Pathology: Cutting bone and teeth material and preparing thin sections. Cutting embedded tissue.
- General Physics: Mounting and slicing single crystals along a particular axis.
- Geology: Preparing mineralogical sections of rocks.
- Paleontology: Preparing sections of fossils in rocks.
