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Diamond Wafering Blades

EXTEC ® High Concentration EP

Specifically manufactured for soft and gummy materials (note: EP diamond wafering blades do not require a dressing stick).

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C-K:
Fast, convenient and economical, the C-K (Clear-Kling) System uses a revolutionary clear backing that allows adhesion without adhesives. C-K discs can be applied to any platen. Select your desired C-K cloth, abrasive disc or diamond lapping film and apply to platen - it instantly adheres. When finished just lift and replace with the next item. C-K discs stay on the platen and may be used repeatedly. Available on a variety of Extec products.
PSA:
PSA (Pressure Sensitive Adhesive) backing that is oil, water & alcohol resistant.
Cloth:
Cloth backing is available for most products.
Plain:
Plain backing is available for most products.
Poly Back:
Extec Poly backing.
Maxima:
Non-metallic, magnetic compatible backing.
Organize Products By:
Catalog # Unit Diameter Thickness Arbor Application  
12222
Each 4.0"
(102.0 mm)
0.03"
(0.83 mm)
0.5"
(12.7 mm)
Recommended for polymers, rubber, soft gummy materials  
12224
Each 5.0"
(127.0 mm)
0.015"
(0.8 mm)
0.03"
(12.7 mm)
Recommended for polymers, rubber, soft gummy materials  
12226
Each 7.0"
(178.0 mm)
0.025"
(0.8 mm)
0.03"
(12.7 mm)
Recommended for polymers, rubber, soft gummy materials  
12228
Each 8.0"
(203.0 mm)
0.035"
(0.9 mm)
0.5"
(12.7 mm)
Recommended for polymers, rubber, soft gummy materials  
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Pricing found on www.extec.com is U.S. only.