Diamond Wafering Blades
EXTEC ® Low Concentration AC
AC (Advanced Ceramic), recommended for medium ceramics, GaAs, AIN, glass fiber composites, electron packages.
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- C-K:
- Fast, convenient and economical, the C-K (Clear-Kling) System uses a revolutionary clear backing that allows adhesion without adhesives. C-K discs can be applied to any platen. Select your desired C-K cloth, abrasive disc or diamond lapping film and apply to platen - it instantly adheres. When finished just lift and replace with the next item. C-K discs stay on the platen and may be used repeatedly. Available on a variety of Extec products.
- PSA:
- PSA (Pressure Sensitive Adhesive) backing that is oil, water & alcohol resistant.
- Cloth:
- Cloth backing is available for most products.
- Plain:
- Plain backing is available for most products.
- Poly Back:
- Extec Poly backing.
- Maxima:
- Non-metallic, magnetic compatible backing.
Organize Products By:
Catalog # | Unit | Diameter | Thickness | Arbor | Application | |
---|---|---|---|---|---|---|
12190 |
Each | 3.0" (76.0 mm) | 0.006" (0.15 mm) | 0.5" (12.7 mm) | Recommended for medium ceramics, GaAs, AIN, glass fiber composites, electron packages |
|
12192 |
Each | 4.0" (102.0 mm) | 0.012" (0.3 mm) | 0.5" (12.7 mm) | Recommended for medium ceramics, GaAs, AIN, glass fiber composites, electron packages |
|
12194 |
Each | 5.0" (127.0 mm) | 0.015" (0.5 mm) | 0.5" (12.7 mm) | Recommended for medium ceramics, GaAs, AIN, glass fiber composites, electron packages |
|
12196 |
Each | 7.0" (178.0 mm) | 0.02" (0.6 mm) | 0.5" (12.7 mm) | Recommended for medium ceramics, GaAs, AIN, glass fiber composites, electron packages |
|
12198 |
Each | 8.0" (203.0 mm) | 0.035" (0.9 mm) | 0.5" (12.7 mm) | Recommended for medium ceramics, GaAs, AIN, glass fiber composites, electron packages |
|
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- Special Packaging
Pricing found on www.extec.com is U.S. only.