Polishing Suspensions
EXTEC ® Colloidal Silica
Available in 0.06 µm and 0.02 µm particle size. Recommended for composites, silicon nitride, cobalt-based alloys, nickel-based alloys, steels, tool steels, electronics and printed circuit boards.
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- C-K:
- Fast, convenient and economical, the C-K (Clear-Kling) System uses a revolutionary clear backing that allows adhesion without adhesives. C-K discs can be applied to any platen. Select your desired C-K cloth, abrasive disc or diamond lapping film and apply to platen - it instantly adheres. When finished just lift and replace with the next item. C-K discs stay on the platen and may be used repeatedly. Available on a variety of Extec products.
- PSA:
- PSA (Pressure Sensitive Adhesive) backing that is oil, water & alcohol resistant.
- Cloth:
- Cloth backing is available for most products.
- Plain:
- Plain backing is available for most products.
- Poly Back:
- Extec Poly backing.
- Maxima:
- Non-metallic, magnetic compatible backing.
Organize Products By:
Catalog # | Unit | Micron Size |
Description | |
---|---|---|---|---|
16788 |
6 oz (150 ml) | 0.06µ | Colloidal Silica |
|
16790 |
64 oz (1.9 l) | 0.06µ | Colloidal Silica |
|
16792 |
6 oz (150 ml) | 0.02µ | Colloidal Silica |
|
16794 |
64 oz (1.9 l) | 0.02µ | Colloidal Silica |
|
- Key:
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- New
- Special Packaging
Pricing found on www.extec.com is U.S. only.